Automated PCB Manufacturing Plant (3333 sq mtr per day)
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AUTOMATED PCB MANUFACTURING PLANT
[EIRI/EDPR/4628] J.C.: 2845XL
INTRODUCTION
PCB Stands for "Printed Circuit Board." A PCB is a thin board made of fiberglass, composite epoxy, or other laminate material. Conductive pathways are etched or "printed" onto board, connecting different components on the PCB, such as transistors, resistors, and integrated circuits.
In other words, A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate.
Multilayer PCB is a type of circuit board that contains three or more layers of conductive material. These boards increase the available area for wiring. Whenever we talk about a number of layers, it means we are considering a number of conducting patterns on the board. Multilayer PCBs are normally Rigid PCB. It is because it is very difficult to create it in a flexible format.
The number of layers depends on your needs. So layers could be up to 100. However, 4 to 8 layer PCBs have common usage in various applications. Circuitry gets complex when layers increase. So you can customize different numbers of layers according to your needs.
COST ESTIMATION
Plant Capacity 3333.334 sq.mt./Day
Land & Building (4000 sq.mt.) Rs. 2.80 Cr
Plant & Machinery Rs. 22.50 Cr
Working Capital for 1 Month Rs. 33.68 Cr
Total Capital Investment Rs. 59.87 Cr
Rate of Return 59%
Break Even Point 29%
CONTENTS
INTRODUCTION
TYPES OF PCB
1. SINGLE-SIDED
ADVANTAGES OF SINGLE-SIDED PCBS INCLUDE:
2. DOUBLE-SIDED
ADVANTAGE AND APPLICATION OF MULTILAYER PCB
SOME ADVANTAGES OF MULTILAYER PCB OVER OTHER TYPES:
DIFFERENT APPLICATIONS OF MULTILAYER PCB
B.I.S. SPECIFICATION
THE INDIAN STANDARDS RELEVANT TO PCBS ARE:-
FOR MORE INFORMATION CONTACT AT:
COMPONENT OF MULTILAYER PCB
THERE ARE 4 MAIN COMPONENTS OF MULTILAYER PCB AS FOLLOWS:
1. SUBSTRATE:
2. COPPER LAYER:
3. SOLDER MASK:
4. SILKSCREEN:
GUIDE OF MANUFACTURING MULTILAYER PCB
1. DESIGNING
2. PHOTO PLOTTING
3. IMAGING AND DEVELOP OR ETCH
4. AUTOMATED OPTICAL INSPECTION
5. OXIDE
6. LAMINATION
7. DRILLING
8. ELECTROLESS COPPER DEPOSITION
9. DRY FILM OUTER LAYER
10. PLATE
11. STRIPING AND ETCHING
12. SOLDER MASK AND LEGEND
13. SURFACE FINISH
MULTILAYER PCB
SEQUENCES IN MULTILAYER PCB
MATERIAL ISSUE
INNER LAYER
INNER LAYER ETCH
INNER LAYER AOI
LAMINATION
DRILLING
ELECTROLESS AND PANEL PLATING
PTH/ELECTROLESS
PANEL PLATING
OUTER LAYER IMAGE
OUTER LAYER IMAGE
PATTERN PLATE
PATTERN PLATE
OUTER LAYER ETCH
OUTER LAYER ETCH
OUTER LAYER AOI
VIA HOLE PLUGGING
SOLDERMASK
SURFACE FINISHES
SURFACE FINISHES
PROFILE
ELECTRICAL TEST
FINAL INSPECTION
MULTILAYER PCB FABRICATION
THE BARE PRINTED CIRCUIT BOARD AFTER FABRICATION
BEFORE PARTS ARE ASSEMBLED TO IT
BUILDING UP THE INNER LAYERS OF THE CIRCUIT BOARD
LAMINATING THE MULTILAYER BOARD TOGETHER
FINALIZING THE BOARD WITH THE FINISHING TOUCHES
PROCESS FLOW DIAGRAM
TECHNICAL DETAILS IN PCB MANUFACTURE
STEP 1 – THE DESIGN
STEP 2 – PRINTING THE DESIGN
STEP 3 – CREATING THE SUBSTRATE
STEP 4 – PRINTING THE INNER LAYERS
STEP 5 – ULTRAVIOLET LIGHT
STEP 6 – REMOVING UNWANTED COPPER
STEP 7 – INSPECTION
STEP 8 – LAMINATING THE LAYERS
STEP 9 – PRESSING THE LAYERS
STEP 10 – DRILLING
STEP 11 – PLATING
STEP 12 – OUTER LAYER IMAGING
STEP 13 – PLATING
STEP 14 – ETCHING
STEP 15 – SOLDER MASK APPLICATION
STEP 16 – SILKSCREENING
STEP 17 – SURFACE FINISH
STEP 18 – TESTING
MANUFACTURING PROCESS OF PCB
1. RAW MATERIALS
2. PANELIZATION
SOME GUIDELINES FOR PANELIZATION ARE SIMPLE FOR EXAMPLE
WITH ROUTED PANELS:
BUT:
AS WITH ALL TECHNICAL SUBJECTS, EXCEPTIONS ABOUND. FOR EXAMPLE:
THIS IS POSSIBLE WITH SOME RESTRICTIONS:
PANELIZATION OF PCBS
3. ETCHING
THE TWO PROCESSING METHODS USED TO PRODUCE A DOUBLE-SIDED
PWB WITH PLATED THROUGH HOLES.
CHEMICAL ETCHING
PCBS IN PROCESS OF HAVING COPPER PATTERN PLATED, NOTICE
THE BLUE DRY FILM RESIST
4. LAMINATION
5. DRILLING
6. EXPOSED CONDUCTOR PLATING & COATING
SOLDER RESIST
7. SCREENING
8. ASSEMBLY
THE COMPONENTS THAT ARE ASSEMBLED IN THE BOARD INCLUDE:
PCB WITH TEST CONNECTION PADS
AFTER THE BOARD HAS BEEN POPULATED IT MAY BE TESTED IN
A VARIETY OF WAYS:
1. SURFACE MOUNT TECHNOLOGY
SURFACES MOUNT COMPONENTS INCLUDING RESISTORS,
TRANSISTORS AND AN INTEGERATED CIRCUITS
ASSEMBLY TECHNIQUES
REWORK
2. THROUGH HOLE TECHNOLOGY
CHARACTERISTICS
9. TESTING
10. CUTTING INDIVIDUAL PCBS FROM THE PRODUCTION PANEL
11. FINAL INSPECTION
12. PROTECTION & PACKAGING
ANTISTATIC
RAPID GROWTH OF PCB INDUSTRY IN INDIA
GLOBAL PCB MARKET
INDIAN PCB MARKET
PCB MARKET SEGMENT
PCB LAMINATE TYPES
CHALLENGES FACED BY INDIAN PCB INDUSTRY
MARKET OVERVIEW OF PCB
SOME OF THESE KEY PLAYERS INCLUDE:
SUPPLIERS OF PCB BOARD
SUPPLIERS OF PCB
ADDRESSES OF RAW MATERIAL SUPPLIERS
SUPPLIERS OF COPPER FOIL
SUPPLIERS OF FIBRE GLASS EPOXY SHEET
SUPPLIERS OF SILK SCREEN
SUPPLIERS OF ETCHING CHEMICALS AND CLEANINGPCB CHEMICALS
SUPPLIERS OF PRINTING INK
SUPPLIERS OF BARE PCB BOARD
SUPPLIERS OF SOLDER PASTE
SUPPLIERS OF SURFACE MOUNTED DEVICES
ADDRESSES OF PLANT AND MACHINERY
SUPPLIERS OF AUTOMATED PLOTTER
SUPPLIERS OF EXPOSURE SYSTEM
SUPPLIERS OF ETCHING CENTRE
SUPPLIERS OF CNC PCB DRILLING MACHINE
SUPPLIERS OF PCB CUTTING MACHINE
SUPPLIERS OF PCB CLEANING MACHINE
SUPPLIERS OF UV PCB CURRING MACHINE & SCREEN PRINTING MACHINE
SUPPLIERS OF DRY FILM LAMINATING MACHINE
SUPPLIERS OF COPPER PLATING MACHINE
SUPPLIERS OF PLATING THICKNESS GAUGE
SUPPLIERS OF PCB TESTING EQUIPMENT
SUPPLIERS OF PCB ASSEMBLING PLANT
SUPPLIERS OF AUTOMATIC OPTICAL INSPECTION EQUIPMENT
SUPPLIERS OF AUTOMATIC XRAY INSPECTION MACHINE
SUPPLIERS OF ELECTRICAL MEASURING INSTRUMENTS
SUPPLIERS OF AIR CONDITIONING EQUIPMENTS
SUPPLIERS OF PLATEFARM WEIGHING MACHINE
SUPPLIERS OF MATERIAL HANDLING EQUIPMENTS
SUPPLIERS OF FIRE FIGHTING EQUIPMENTS
APPENDIX – A:
01. PLANT ECONOMICS
02. LAND & BUILDING
03. PLANT AND MACHINERY
04. OTHER FIXED ASSESTS
05. FIXED CAPITAL
06. RAW MATERIAL
07. SALARY AND WAGES
08. UTILITIES AND OVERHEADS
09. TOTAL WORKING CAPITAL
10. TOTAL CAPITAL INVESTMENT
11. COST OF PRODUCTION
12. TURN OVER/ANNUM
13. BREAK EVEN POINT
14. RESOURCES FOR FINANCE
15. INSTALMENT PAYABLE IN 5 YEARS
16. DEPRECIATION CHART FOR 5 YEARS
17. PROFIT ANALYSIS FOR 5 YEARS
18. PROJECTED BALANCE SHEET FOR (5 YEARS)
How to Make Project Report?
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Overview of key market forces propelling and restraining market growth:
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