Complete Technology Handbook on Semiconductor, Microchips and Electronic Circuits with Project Profiles (Manufacturing, Fabrication and Physics)

Complete Technology Handbook on Semiconductor, Microchips and Electronic Circuits with Project Profiles (Manufacturing, Fabrication and Physics)

The book contains chapters on Introduction, Promotion by Government of India, Introduction to the Basic Concepts: Microchip, Conductor, Insulator, and Semiconductor, Basic Knowledge of Electric Circuits, Brief Introduction of Theories, Early Radio Communication, Transistor and Integrated Circuit, Basic Knowledge of Process, Semiconductor Manufacturing and Sustainability, Technology Overview, Nanotechnology and Nanomanufacturing: From Silicon to New Carbon- based Materials and Beyond, Fundamentals of FinFET and Recent Advances in Nano-scale Silicide Formation, Epitaxy, Thermal Processing: Anneals, RTP, and Oxidation, Microlithography, Etching, Ion Implantation, Introduction to Physical Vapor Deposition, Chemical Vapor Deposition, Atomic Layer Deposition, Electrochemical Deposition, Fundamentals of Chemical Mechanical Planarization, AFM Metrology, Wafer Thinning and Singulation, Packaging, Interconnect Reliability, Automatic Test Equipment, Printed Electronics: Principles, Materials, Processes, and Applications, Statistical Experimental Design, Process Modelling, Advanced Process Control, Flexible Hybrid Electronics, Flexible Electronics, RF Printed Electronics: Communication, Sensing, and Energy Harvesting for the Internet of Things and Smart Skin Applications, Printing of Nanoscale Electronics and Power Electronics, 3D Interconnects in Flexible Electronics, Materials for the Manufacturing of an Inkjet Printed Touch Sensor, Flat-Panel and Flexible Display Technology, Photovoltaics Fundamentals, Manufacturing, Installation, and Operations, Semiconductor Photonic Devices, Semiconductor Light Detection and Photocell, Dielectric Films Growth, Operations, Equipment, and Facilities, Factors for Constructing Variables Control Charts, Plant Economics of Integrated Circuits, Plant Economics of Earth Leakage Circuit Breakers, Plant Economics of Electric Switches Plugs Sockets & MCB (Miniature Circuit Breaker), Plant Economics of MCB (Miniature Circuit Breaker) and DB (Distribution Board), Plant Economics of PCB Laminate and PCB Board.

Chapter 1

Introduction

• Semiconductor Device Structure
• Semiconductor Devices In Systems
• Getting Designed In
• System IP and Standards
• The Evolving Electronics Supply Chain
• Bandgap
• Crystal structure
• Doping semiconductor
• Major Fabrication Steps in (metal-oxide semiconductor) MOS Process Flow
• Model of Typical Wafer Flow in a Sub-Micron CMOS IC Fab
• Diffusion: Simplified Schematic of High-Temperature Furnace

Chapter 2

Promotion by Government of India

• India’s Semiconductor Sector
• India Semiconductor Mission
• India’s semiconductor program: Progress report
• Impact of the recent approvals
• The India advantage
• Pacing up of initiatives
• Inching up the value chain
• Leveraging the talent edge
• Modified Programme for Semiconductors and Display Fab Ecosystem

Chapter 3

Introduction to the Basic Concepts: Microchip, Conductor, Insulator and Semi-conductor

• What Is a Microchip? 
• How are microchips made?
• Types of microchips
• Manufacturing Process of Microchips: Time-Honored Techniques and Principles
• Digital Processing: The Brain of Electronic Devices
• Signal Processing and Management
• Storage and Memory: The Keepers of Data
• Control and Interface: The Command Center
• Power Management: Maximizing Efficiency
• Ohm’s Law and Resistivity
• Ohm’s Law Formulas
• Ohm’s Law Triangle
• Resistivity
• Vector Expression
• Conductor, Insulator and Semiconductor
• Band Theory
• The Definition of A Conductor
• The Definition of a Semiconductor
• The Definition of an Insulator
• Conductors
• Semiconductors
• Insulators

Chapter 4

Basic Knowledge of Electric Circuits

• Step 1: Open Circuit
• Step 2: Closed Circuit
• Step 3: Short Circuit
• Step 4: Series Circuit
• Advantage of series circuits
• Step 5: Parallel Circuit
• Electric Circuits and the Components
• Electric Field
• Electric Field Formula
• Electric Fields in Technology
• Magnetic Field
• Alternating Current
• Alternating Current Production
• Application of Alternating Current
• Alternating Current Waveform
• AC Alternators

Chapter 5

Brief Introduction of Theories

• Origin of Semiconductor
• Electronic Properties of Semi-conductor Materials
• Brief History of Integrated Circuits
• First transistor
• First integrated circuit
• The Birth of Quantum Mechanics
• Quantum Theory Development
• Impact of Quantum Theory
• Main features of quantum mechanics
• Significance of Quantum Mechanics
• Energy Band (Band)
• Introduction
• Formation of Energy Bands
• Energy Band Theory
• Valance Band
• Conduction Band
• Forbidden Gap
• Types of Energy Bands
• Insulators
• Semiconductors
• Conductors

Chapter 6

Early Radio Communication

• Radio Communications Comes of Age
• Cellular Technology
• Telegraph Technology
• Invention of the telegraph
• Further development of the telegraph
• Legacy of the telegraph
• Morse Code
• The Impact
• How does a telegraph work?
• Technological Advances
• Morse and His Partners
• Rival Patents
• Multilateral Oligopolies
• Mistransmission Problems
• Horizontal and System Integration
• Electron Tube
• History of Vacuum tubes
• Different Types of Vacuum Tube
• Diode Vacuum Tubes
• Triode Vacuum Tubes
• Tetrode Vacuum Tubes
• Pentode Vacuum Tubes
• Principles of Vacuum Tubes

Chapter 7

Transistor and Integrated Circuit

• The origin of the Transistor
• Integrated Circuit (IC)
• Integrated Circuit Design
• Digital Design
• Analog Design
• Mixed Design
• Integrated Circuit Construction
• Bipolar Transistor
• Construction of BJT
• Operation of BJT
• Types of BJTs
• NPN Transistor
• PNP Transistor
• Bipolar Transistor Configurations
• Common Base Configuration
• Characteristics curves
• Common Emitter Configuration
• Common Collector Configuration
• The Common Base Transistor Circuit
• The Common Emitter (CE) Configuration
• The Common Emitter Amplifier Circuit
• The Common Collector (CC) Configuration
• The Common Collector Transistor Circuit
• Bipolar Transistor Summary
• Bipolar Transistor Configurations
• NPN Transistor
• A Bipolar NPN Transistor Configuration
• NPN Transistor Connection
• Single Stage Common Emitter Amplifier Circuit
• PNP Transistor
• A PNP Transistor Configuration
• PNP Transistor Connection
• A PNP Transistor Circuit
• Transistor Matching
• Complementary Transistors
• Identifying the PNP Transistor
• Terminal Resistance Values for PNP and NPN Transistors
• Junction Field Effect Transistor
• The Field Effect
• The Junction Field Effect Transistor
• Biasing of an N-channel Junction Field Effect Transistor
• Junction Field effect Transistor Channel Pinched-off
• Drain current in the active region
• Drain-Source Channel Resistance
• Modes of FET’s
• Common Source (CS) Configuration
• Common Gate (CG) Configuration
• Common Drain (CD) Configuration
• The Junction Field Effect Transistor Amplifier
• Biasing of the Junction Field Effect Transistor Amplifier
• Metal-Semiconductor Field Effect Transistor (MESFET)
• Symbol of MESFET
• Structure of MESFET
• Non self aligned structure of MESFET
• Depletion mode of MESFET
• Applications of MESFET:
• Metal–Insulator–Semiconductor Field Effect Transistor
• Fabrication of devices
• Characterization

Chapter 8

Basic Knowledge of Process

• Backbone of IoT and digital transformation:
• Semiconductors Megatrends and Opportunities Ahead
• The role of process nodes in semiconductor technologies
• The Structure of Integrated Circuit (IC)
• Structure and composition of integrated circuits
• System level
• Module level
• Register transfer level (RTL)
• Gate level
• Transistor level
• Packages of Integrated circuit
• Resolution of Optical System
• Effects of Optical Resolution and Spatial Sampling on Data
• Effect of changing spatial sampling while using the same optical resolution
• Why Plasma Used in the Process
• Introduction
• Plasma is all around us
• Harnessing the energy of plasma
• Art of building chips
• Plasma Used In Nearly Half of The Steps
• Demand For Plasma Will Increase
• Plasma works at the atomic scale
• Perpetual search for the best plasma recipes
• More tough challenges to solve

Chapter 9

Semiconductor Manufacturing and Sustainability

• Historical Evolution
• Semiconductor manufacturing process overview
• Semiconductor manufacturing trends and challenges
• Semiconductor Manufacturing, the Internet of Things and Sustainability
• Sensing and data acquisition
• Processing and control
• Connectivity and communication
• Security and privacy
• Innovations In IOT Devices Driven By Semiconductor Companies
• Key Considerations For Semiconductor Design In IoT
• The Future Of Semiconductors And The Internet of Things (IoT)
• Goals of Manufacturing
• Build-In Reliability
• Manage Reliability Growth
• Failure Data Reporting
• Failure Review Board
• Corrective Action
• Reliability Testing
• Types of Reliability Tests
• Burn-in Tests
• Environmental Stress Screening Tests
• Design Verification Tests
• Reliability Development/Growth Tests
• Reliability Qualification Tests
• Generic Steps for Reliability Tests
• Test Plan Development

Chapter 10

Technology Over-view

• Introduction
• The fabrication of a semiconductor device
• Photomasking Process
• Metal Deposition Process
• Etching Process
• Wire Bonding
• Different Kinds of Plastic Packages
• The Transistor
• MOS Technology
• Fabrication of a transistor
• Technological Challenges
• Challenge 1: Achieving High Resolution
• Challenge 2: Ensuring Accuracy
• Challenge 3: Mass Production
• Looking Ahead
• Indian Semiconductor Scenario
• R&D in Semiconductors in India
• Scheme for Promotion of Manufacturing of Electronic Components and Semiconductors (SPECS)
• Unit Processes
• Lithography
• Etching
• Oxidation
• Deposition
• Metalization
• Ion implantation
• Diffusion
• Process Integration
• Wafer Preparation
• Isolations
• Blanket field oxide
• Local oxidation of silicon
• Shallow trench isolation
• Transistor Formation

Chapter 11

Nanotechnology and Nanomanufacturing: From Silicon to New Carbon-based Materials and Beyond

• Introduction
• What is nanotechnology?
• Why Is Nanotechnology Important?
• Examples of Nanotechnology
• History of Nanotechnology
• History of Nanomaterials: From Prehistory to the Modern Age
• Faraday Experiments with Nanoparticles
• Tools of Nanotechnology in the Twentieth Century
• Transmission Electron Microscope (TEM)
• Scanning Tunnel Microscope (STM)
• Atomic Force Microscope (AFM)
• The Age of Nanotechnology from Feynman to Nano-fabrication
• Feynman the Father of Nanotechnology
• Taniguchi Coins Term Nanotechnology
• Drexler and the Coming Era of Nanotechnology
• Building on biological principles
• Silicon nanoparticles: fabrication, characterization, application and perspectives
• Carbon and Carbon Nanomaterials
• Introduction
• Atomic Structure of Carbon
• Nanotechnology Revolutionizing Wafer Manufacturing
• Driving Innovation, Collaboration, and Automation
• Nanotechnology in Wafer Fabrication
• Pioneering Nanopatterning Techniques
• Precise Nanoscale Etching and Deposition
• Nanoelectronics and Quantum Devices
• Innovative Nanomaterials for Advanced Packaging
• Nanotechnology for Sensing and MEMS Devices
• Challenges and Future Directions
• Nanofabrication Opportunities in the Semiconductor Industry
• Lithography
• Block Copolymer and Polymer Brush Lithography
• Polymer Selection
• Polymer Deposition onto Substrates
• Polymer-Based Pattern Formation
• Metal Incorporation and Oxidative Removal of the Polymer
• Nanotechnology Metrology
• Scope
• Current Scientific and Technological Advancements
• Goals, Barriers, and Solutions
• R&D Investment and Priority Research Areas
• Scientific and technical infrastructure needs
• Nanotechnology Manufacturing
• Manufacturing Approaches to Nanomaterials
• How Nanomaterials Are Used in Manufacturing
• Nanotechnology-for-semiconductors
• Semiconductor nanoparticles
• Semiconductors and Artificial Intelligence
• Designing the Chips with Artificial Intelligence
• AI-Powered Advancements in Chip Design
• Revolutionizing Semiconductor Verification and Testing for Enhanced Reliability
• Challenges in AI-Driven Chip Design
• AI in Semiconductor Industry: Use Cases
• AI’s Impact on Future Semiconductor Chip Design Trends
• Inside an AI Chip
• AI Chips in Brief
• No advanced chips, no AI applications
• Inside an AI Chip
• Microscopic view of an AI chip
• AI Chips in Brief
• No advanced chips, no AI applications
• Primer on AI Chips Fabrication
• Front End
• Back End
• Steps in semiconductor manufacturing
• Wet Etching
• Dry Etching
• Wafer Fabrication
• Summary of the major processing steps in the fabrication of a semi-conductor device

Chapter 12

Fundamentals of FinFET and Recent Advances in Nano-scale Silicide Formation

• Introduction
• FinFET
• SOI vs. Bulk FinFET Technology
• Use FinFETs
• Beyond FinFET and Below 5 nm
• Benefits of FinFETSoC Design
• Advances in Nanoscale Silicide Formation
• Silicide Formation
• Solid-State Amorphization
• The First Nucleated Phase and Simultaneous Occurrence of Multiphases
• Growth Kinetics of Silicides
• Dominant Diffusing Species
• Epitaxial Growth of Silicides
• Nanoscalesilicides
• Nanodots
• Self-Assembled Low-Resistivity Metal Silicide Quantum Dot Arrays on Epitaxial Si0.7Ge0.3 on (001)Si
• Formation of Epitaxial b-FeSi2 Nanodot Arrays on Strained Si/SiO.8Ge0.2 (001) Substrate
• First Nucleated Phase and the Dominant Diffusing Species
• Nanowires
• Self-Assembled Nanowires
• Alternative Growth of Silicide Nanowires
• Foundations of Microsystems Manufacturing: An Empowering Technology for the IoT
• MEMS as a Microsensor:
• MEMS as a Microactuator-motor
• Components of Microsystems
• Typical Microsystems Products
• Inertia Sensor for “Air Bag” Deployment System
• Evolution of Microfabrication
• Application of MEMS and Microsystems in Consumer Products
• Functionalisation
• Integration
• Individualisation
• Taking mems technology to the next level
• MEMS products and services
• TECAWAFER
• Wafer manufacturing revolution: functionalisation, integration & customisation
• Wafer functionalisation
• Wafer integration
• Wafer individualisation
• Sensors: Revolutionising technology
• Sensor functionalisation
• Sensor integration
• Sensor individualisation
• Transformers
• Reliable 3D Integrated Circuits
• Benefits of 3D Integration in VLSI Circuits
• Types of 3D Integration Techniques
• Advancements in 3D Integration Technology
• Working Principles of 3D ICs
• Importance of 3D ICs
• Acceleration of Artificial Intelligence (AI)
• Addressing Moore’s Law Extension:
• Future Challenges of 3D ICs
• Design Challenges
• Standardization and Interoperability:
• Cost Considerations
• Wafer State Measurements
• Wafer Cutting
• Thin Film Deposition
• Lithography
• Capacitance-Based Technology for Non-Contact Wafer Inspection
• Proforma Technology for Non-Contact Wafer Inspection
• The Proforma 300i Manual Semiconductor Metrology System
• The Proforma 300iSA Semi-Automated Metrology System
• Wafer Edge Measurement-pinpoint precise
• Wafer Edge Measurement-Reliable Projection Technology
• Small footprint and consistent accuracy

Chapter 13

Epitaxy

• Types of Epitaxial Growth
• Key Parameters to Be Controlled in Epitaxial Growth
• Epitaxy Density and Rate
• Epi Process Methods
• Epitaxial Growth of Thin Film Materials and Its Applications

Chapter 14

Thermal Processing: Anneals, RTP and Oxidation

• Thermal Process
• Thermal Process Applications
• Material Requirements in the Thermal Process–Perfluoroelastomers
• How does Thermal Processing/Annealing work?

Chapter 15

Microlithography

• The Lithographic Process
• Process of semiconductor lithography
• Immersion lithography
• Multiple patterning
• Importance of Microlithography
• Photo Solutions’ Custom Microlithography Services
• Reticles
• Measuring and Calibration Standards
• Alignment Targets

Chapter 16

Etching

• Basic Processes
• Semiconductor Etching Products

Chapter 17

Ion Implantation

• Ideal product properties
• Ion Implantation Products

Chapter 18

Introduction to Physical Vapor Deposition

• Introduction
• The Science Behind PVD Coating
• The Role of Vacuum in PVD Coating
• The Role of Vapor in PVD Coating
• Types of PVD Coating Processes Used in Semiconductors
• Sputtering
• Vacuum chamber for thin film sputtering
• Evaporation
• Vacuum coating by thermal evaporation
• Materials Used in PVD Coating of Semiconductors
• Metals
• Ceramics
• Applications of PVD Coating in Semiconductors
• Microelectronics

Chapter 19

Chemical Vapor Deposition

• CVD Process in Semiconductors
• Chemical Vapor Deposition Techniques
• Atmospheric Pressure CVD (APCVD)
• Low-pressure CVD (LPCVD)
• Plasma Enhanced CVD (PECVD)
• CVD in Semiconductor Manufacturing

Chapter 20

Atomic Layer Deposition

• Atomic Layer Deposition
• The Atomic Layer Deposition (ALD) Process
• Comparing ALD and CLD
• Key Advantages of ALD
• ALD for Microelectronics

Chapter 21

Electrochemical Deposition

• Deposition process
• Process parameters
• Materials in electrochemical cell

Chapter 22

Fundamentals of Chemical Mechanical Planarization

• CMP in Shallow Trench Isolation Processing

Chapter 23

AFM Metrology

• Atomic Force Microscopy
• How an Atomic Force Microscope works
• AFM Probe Deflection
• Measuring Forces
• Feedback Loop for Atomic Force Microscopy

Chapter 24

Wafer Thinning and Singulation

• Introduction
• Wafer singulation process
• Methods for Wafer Thinning
• Allegro X for Wafer Packaging
• Wafer Thinning Benefits
• Wafer Thinning with Conventional Grind
• Wafer Thinning with Chemical-Mechanical Planarization (CMP)
• Wafer Thinning & Dicing

Chapter 25

Packaging

• Wafer-Level Packaging
• Bumping and Flip Chips
• Redistribution Layers
• Fan-Out WLP
• Through-Silicon Vias
• Packaging Technology Evolution
• Understanding Wafer Bumping Packaging Technology

Chapter 26

Interconnect Reliability

• Nano-Interconnects
• 3D Integration
• Electromigration
• How Does Electromigration Work?
• Factors affecting electromigration:
• Stress Migration

Chapter 27

Automatic Test Equipment

• ATE History
• Components of an ATE system
• How is ATE used?
• Key Automation Tools
• Linear Tester
• Features
• Specification
• Mixed-Signal Tester
• Mixed-Signal IC Test and Measurement
• Purpose of Continuity Testing

Chapter 28

Printed Electronics: Principles, Materials, Processes, and Applications

• Printed Electronics vs. Traditional Electronic Device Manufacturing Technology
• Printed Electronics Technology
• The Concept of Printed Electronics Technology
• The Main Elements Involved in Printed Electronics Technology
• Main Elements involved in Printed Electronics
• Printing
• Functional Pattern Carrier
• Functional Electronics Inks
• Printing Materials
• Printing Pressure
• Curing/Sintering
• The Main Limitations of Printed Electronics Technology
• Printed Electronics Products and Developing Trends
• Smart Integration Systems
• Applications
• Consumer electronics
• Healthcare
• Transportation and logistics
• Internet of Things (IoT)
• RFID humidity and temperature logger for cigar packet

Chapter 29

Statistical Experimental Design

• Statistical Methods
• Comparing Distributions
• Analysis of Variance
• Philosophy of the Taguchi Method
• Taguchi Method Design of Experiments

Chapter 30

Process Modelling

• Process modelling example
• Process specification and verification

Chapter 31

Advanced Process Control

• Applications of APC
• Terminology:
• Run-by-Run Control with Constant Term Adaptation

Chapter 32

Flexible Hybrid Electronics

• Opportunities in Flexible Hybrid electronics
• Challenges in Flexible Hybrid Electronics

Chapter 33 

Flexible Electronics

• Fabrication Process
• Key Materials for Fabrication Process
• Technologies used in the manufacturing of Flexible Electronics
• Applications

Chapter 34

RF Printed Electronics: Communication, Sensing, and Energy Harvesting for the Internet of Things and Smart Skin Applications

• Key Points in RF PCBs Manufacturing
• Substrate Material Selection
• Ensure Accuracy of High-frequency Signal in Production
• Types of RF Printed Circuit Boards
• Rigid RF PCBs
• Flexible RF PCBs
• Rigid-Flex RF PCBs
• High-Frequency RF PCBs
• RF Antenna PCBs
• Advantages of RF PCB
• Improved Signal Integrity
• Low Loss Material
• Accurate Impedance Control
• High Frequency Operations
• Better Component Placement
• Reduced Crosstalk
• Component Placement and Layout
• Signal Integrity and EMI
• Manufacturing and Testing Considerations
• Smart Skin Applications
• Smart skin patches
• Frequency
• Layout
• Shielding
• Energy Harvesting for the Internet of Things
• How it works:
• Benefits
• Applications of RF printed electronics energy harvesting in IoT

Chapter 35

Printing of Nanoscale Electronics and Power Electronics

• Micro Nano Printing Technologies
• Stereolithography Printing
• Two Photon Polymerization (TPP)
• Dip-Pen Nanolithography (DPN)

Chapter 36

3D Interconnects in Flexiible Electronics

• Flexible Electronics
• Flexible Interconnects

Chapter 37

Materials for the Manufacturing of an Inkjet Printed Touch Sensor

• Workflow of 3D Inkjet Printing (IJP) Fabrication for Printed IDE Capacitive Sensor
• Fabrication of FPS Using Inkjet Printer
• Verification of Printed FPS

Chapter 38

Flat-Panel and Flexible Display Technology

• Applications
• Technical details
• Electronic paper
• HP and ASU e-paper
• Asu e-paper
• LG e-paper
• The Future of Flexible Display Technology
• Manufacturing
• Types of Display Systems

Chapter 39

Photovoltaics Fundamentals, Manufacturing, Installation and Operations

• PV Module Manufacturing
• Materials

Chapter 40

Semiconductor Photonic Devices

• Various applications for photonic chips
• Technology
• Features
• Application

Chapter 41

Semiconductor Light Detection and Photocell

• Digital Camera and CCD
• Photoconductor
• Photoconductor Construction & Working Principle
• Photoconductor Working
• Photoconductivity in Semiconductors
• Uses of a Photoconductor
• Photo-diode
• Photoresistor
• Transistor Laser
• Construction of transistor
• Solar Cell
• Solar cells: production process
• Solar Cell: Technology Analysis
• High cost of equipment and materials, high engineering difficulty
• N-type IBC solar cells
• PERC solar cell efficiency potential analysis

Chapter 42

Dielectric Films Growth

• The Growth of Silicon Dioxide Film
• Thermal Oxidation Process
• Dry oxidation using oxygen gas
• Oxide Growth Kinetics
• Fabrication Technology of Silicon Dioxide Thin Film
• Wet Oxide method
• Sample preparation
• Procedure
• Low temperature oxide (LTO) process
• PECVD Process of Silicon Dioxide
• Deposition
• Film Quality: Moisture, Stress, and Cracking
• The Growth of Silicon Nitride Film
• Chemical Vapor Deposition
• Precursor Gas Atmosphere and Deposition Temperature
• Thermal Properties
• Physical Vapor Deposition
• LPCVD deposition of silicon oxide
• LPCVD-depostion of silicon nitrid
• LPCVD-depostion of poly-silicon
• LPCVD-depostion of metals
• PECVD Nitride
• PECVD deposition systems
• Tension, stress

Chapter 43

Operations, Equipment and Facilities

• Yield Management
• Strategies for Enhanced Manufacturing Efficiency
• Challenges and Solutions in Semiconductor Yield Management: A Comprehensive Overview
• The Role of Data Analytics in Semiconductor Yield Management: Leveraging Big Data for Improved Performance
• Advanced Process Control Techniques for Semiconductor Yield Improvement
• Next-Generation Technologies Driving Innovation in Semiconductor Yield Management
• CIM and Factory Automation
• MES Fundamentals
• The Functions of a Semiconductor Manufacturing Execution System
• Manufacturing Process Control
• Advanced Process Control
• Airborne Molecular Contamination
• Monitoring AMCs is Key to Contamination Prevention
• Multi-Max AMC Monitoring Solution
• Benefits
• ESD Controls in Cleanroom Environments
• ESD Control in Cleanrooms: A Simple Guide
• What is Electrostatic Discharge?
• Cleanroom Humidity Control
• Cleanroom Personnel Equipment
• Cleanroom Furniture Grounding Tabs/Drag Chains
• Cleanroom Static Dissipative Flooring
• Esd Control Footwear, Casters
• Clothing
• Vacuum Systems
• Cleanliness and Vacuum Technology in Semiconductor Manufacturing
• High-Quality Components for Semiconductor Vacuum Systems
• Semiconductor Vacuum Systems: Maintain High Purity With Swagelok Fittings
• Control of RF Plasma Processing
• The Role of Radio Frequency
• Gas Ionization Process
• Electron Heating Mechanism
• Plasma Confinement Techniques
• Technical Insights into RF Plasma Generation
• Applications of RF Plasma Generators
• IC Manufacturing Equipment Parts Cleaning Technology
• Uses of Semiconductor Cleaning Equipment
• Principle of Semiconductor Cleaning Equipment
• Types of Semiconductor Cleaning Equipment
• How to Select Semiconductor Cleaning Equipment
• Cleaning Process of Semiconductors
• Step 1: Initial Cleaning
• Step 2: Oxide Removal
• Step 3: Particle Removal
• Step 4: Chemical Cleaning
• Step 5: Final Rinse and Drying
• Step 6: Quality Control
• Vibration and Noise Design
• System Description

Chapter 44

Factors for Constructing Variables Control Charts

• Shewhart Control Charts for variables
• Process Capability Analysis
• General guidelines to prepare control charts
• Factors for constructing variables control charts

Chapter 45

Plant Economics of Integrated Circuits

• Plant Economics
• Plant & Machinery
• Fixed Capital
• Working Capital Requirement/Month
• Total Capital Investment
• Turn Over/Annum

Chapter 46

Plant Economics of Earth Leakage Circuit Breakers

• Plant Economics
• Land & Building
• Plant & Machinery
• Fixed Capital
• Working Capital Requirement/Month
• Total Capital Investment
• Turn Over/Annum

Chapter 47

Plant Economics of Electric Switches Plugs Sockets & MCB (Miniature Circuit Breaker)

• Plant Economics
• Land & Building
• Plant & Machinery
• Fixed Capital
• Working Capital Requirement/Month
• Total Capital Investment
• Turn Over/Annum

Chapter 48

Plant Economics of MCB (Miniature Circuit Breaker) and DB (Distribution Board)

• Plant Economics
• Land & Building
• Plant & Machinery
• Fixed Capital
• Working Capital Requirement/Month
• Total Capital Investment
• Turn Over/Annum

Chapter 49

Plant Economics of PCB Laminate and PCB Board

• Plant Economics
• Land & Building
• Plant & Machinery
• Fixed Capital
• Working Capital Requirement/Month
• Total Capital Investment
• Turn Over/Annum