Complete Technology Handbook on Semiconductor, Microchips and Electronic Circuits with Project Profiles (Manufacturing, Fabrication and Physics)

Complete Technology Handbook on Semiconductor, Microchips and Electronic Circuits with Project Profiles (Manufacturing, Fabrication and Physics)

The book contains chapters on Introduction, Promotion by Government of India, Introduction to the Basic Concepts: Microchip, Conductor, Insulator, and Semiconductor, Basic Knowledge of Electric Circuits, Brief Introduction of Theories, Early Radio Communication, Transistor and Integrated Circuit, Basic Knowledge of Process, Semiconductor Manufacturing and Sustainability, Technology Overview, Nanotechnology and Nanomanufacturing: From Silicon to New Carbon- based Materials and Beyond, Fundamentals of FinFET and Recent Advances in Nano-scale Silicide Formation, Epitaxy, Thermal Processing: Anneals, RTP, and Oxidation, Microlithography, Etching, Ion Implantation, Introduction to Physical Vapor Deposition, Chemical Vapor Deposition, Atomic Layer Deposition, Electrochemical Deposition, Fundamentals of Chemical Mechanical Planarization, AFM Metrology, Wafer Thinning and Singulation, Packaging, Interconnect Reliability, Automatic Test Equipment, Printed Electronics: Principles, Materials, Processes, and Applications, Statistical Experimental Design, Process Modelling, Advanced Process Control, Flexible Hybrid Electronics, Flexible Electronics, RF Printed Electronics: Communication, Sensing, and Energy Harvesting for the Internet of Things and Smart Skin Applications, Printing of Nanoscale Electronics and Power Electronics, 3D Interconnects in Flexible Electronics, Materials for the Manufacturing of an Inkjet Printed Touch Sensor, Flat-Panel and Flexible Display Technology, Photovoltaics Fundamentals, Manufacturing, Installation, and Operations, Semiconductor Photonic Devices, Semiconductor Light Detection and Photocell, Dielectric Films Growth, Operations, Equipment, and Facilities, Factors for Constructing Variables Control Charts, Plant Economics of Integrated Circuits, Plant Economics of Earth Leakage Circuit Breakers, Plant Economics of Electric Switches Plugs Sockets & MCB (Miniature Circuit Breaker), Plant Economics of MCB (Miniature Circuit Breaker) and DB (Distribution Board), Plant Economics of PCB Laminate and PCB Board.

Chapter 1

Introduction

Semiconductor Device Structure

Semiconductor Devices In Systems

Getting Designed In

System IP and Standards

The Evolving Electronics Supply Chain

Bandgap

Crystal structure

Doping semiconductor

Major Fabrication Steps in (metal-oxide semiconductor) MOS Process Flow

Model of Typical Wafer Flow in a Sub-Micron CMOS IC Fab

Diffusion: Simplified Schematic of High-Temperature Furnace

Chapter 2

Promotion by Government of India

India’s Semiconductor Sector

India Semiconductor Mission

India’s semiconductor program: Progress report

Impact of the recent approvals

The India advantage

Pacing up of initiatives

Inching up the value chain

Leveraging the talent edge

Modified Programme for Semiconductors and Display Fab Ecosystem

Chapter 3

Introduction to the Basic Concepts: Microchip, Conductor, Insulator and Semi-conductor

What Is a Microchip? 

How are microchips made?

Types of microchips

Manufacturing Process of Microchips: Time-Honored Techniques and Principles

Digital Processing: The Brain of Electronic Devices

Signal Processing and Management

Storage and Memory: The Keepers of Data

Control and Interface: The Command Center

Power Management: Maximizing Efficiency

Ohm’s Law and Resistivity

Ohm’s Law Formulas

Ohm’s Law Triangle

Resistivity

Vector Expression

Conductor, Insulator and Semiconductor

Band Theory

The Definition of A Conductor

The Definition of a Semiconductor

The Definition of an Insulator

Conductors

Semiconductors

Insulators

Chapter 4

Basic Knowledge of Electric Circuits

Step 1: Open Circuit

Step 2: Closed Circuit

Step 3: Short Circuit

Step 4: Series Circuit

Advantage of series circuits

Step 5: Parallel Circuit

Electric Circuits and the Components

Electric Field

Electric Field Formula

Electric Fields in Technology

Magnetic Field

Alternating Current

Alternating Current Production

Application of Alternating Current

Alternating Current Waveform

AC Alternators

Chapter 5

Brief Introduction of Theories

Origin of Semiconductor

Electronic Properties of Semi-conductor Materials

Brief History of Integrated Circuits

First transistor

First integrated circuit

The Birth of Quantum Mechanics

Quantum Theory Development

Impact of Quantum Theory

Main features of quantum mechanics

Significance of Quantum Mechanics

Energy Band (Band)

Introduction

Formation of Energy Bands

Energy Band Theory

Valance Band

Conduction Band

Forbidden Gap

Types of Energy Bands

Insulators

Semiconductors

Conductors

Chapter 6

Early Radio Communication

Radio Communications Comes of Age

Cellular Technology

Telegraph Technology

Invention of the telegraph

Further development of the telegraph

Legacy of the telegraph

Morse Code

The Impact

How does a telegraph work?

Technological Advances

Morse and His Partners

Rival Patents

Multilateral Oligopolies

Mistransmission Problems

Horizontal and System Integration

Electron Tube

History of Vacuum tubes

Different Types of Vacuum Tube

Diode Vacuum Tubes

Triode Vacuum Tubes

Tetrode Vacuum Tubes

Pentode Vacuum Tubes

Principles of Vacuum Tubes

Chapter 7

Transistor and Integrated Circuit

The origin of the Transistor

Integrated Circuit (IC)

Integrated Circuit Design

Digital Design

Analog Design

Mixed Design

Integrated Circuit Construction

Bipolar Transistor

Construction of BJT

Operation of BJT

Types of BJTs

NPN Transistor

PNP Transistor

Bipolar Transistor Configurations

Common Base Configuration

Characteristics curves

Common Emitter Configuration

Common Collector Configuration

The Common Base Transistor Circuit

The Common Emitter (CE) Configuration

The Common Emitter Amplifier Circuit

The Common Collector (CC) Configuration

The Common Collector Transistor Circuit

Bipolar Transistor Summary

Bipolar Transistor Configurations

NPN Transistor

A Bipolar NPN Transistor Configuration

NPN Transistor Connection

Single Stage Common Emitter Amplifier Circuit

PNP Transistor

A PNP Transistor Configuration

PNP Transistor Connection

A PNP Transistor Circuit

Transistor Matching

Complementary Transistors

Identifying the PNP Transistor

Terminal Resistance Values for PNP and NPN Transistors

Junction Field Effect Transistor

The Field Effect

The Junction Field Effect Transistor

Biasing of an N-channel Junction Field Effect Transistor

Junction Field effect Transistor Channel Pinched-off

Drain current in the active region

Drain-Source Channel Resistance

Modes of FET’s

Common Source (CS) Configuration

Common Gate (CG) Configuration

Common Drain (CD) Configuration

The Junction Field Effect Transistor Amplifier

Biasing of the Junction Field Effect Transistor Amplifier

Metal-Semiconductor Field Effect Transistor (MESFET)

Symbol of MESFET

Structure of MESFET

Non self aligned structure of MESFET

Depletion mode of MESFET

Applications of MESFET:

Metal–Insulator–Semiconductor Field Effect Transistor

Fabrication of devices

Characterization

Chapter 8

Basic Knowledge of Process

Backbone of IoT and digital transformation:

Semiconductors Megatrends and Opportunities Ahead

The role of process nodes in semiconductor technologies

The Structure of Integrated Circuit (IC)

Structure and composition of integrated circuits

System level

Module level

Register transfer level (RTL)

Gate level

Transistor level

Packages of Integrated circuit

Resolution of Optical System

Effects of Optical Resolution and Spatial Sampling on Data

Effect of changing spatial sampling while using the same optical resolution

Why Plasma Used in the Process

Introduction

Plasma is all around us

Harnessing the energy of plasma

Art of building chips

Plasma Used In Nearly Half of The Steps

Demand For Plasma Will Increase

Plasma works at the atomic scale

Perpetual search for the best plasma recipes

More tough challenges to solve

Chapter 9

Semiconductor Manufacturing and Sustainability

Historical Evolution

Semiconductor manufacturing process overview

Semiconductor manufacturing trends and challenges

Semiconductor Manufacturing, the Internet of Things and Sustainability

Sensing and data acquisition

Processing and control

Connectivity and communication

Security and privacy

Innovations In IOT Devices Driven By Semiconductor Companies

Key Considerations For Semiconductor Design In IoT

The Future Of Semiconductors And The Internet of Things (IoT)

Goals of Manufacturing

Build-In Reliability

Manage Reliability Growth

Failure Data Reporting

Failure Review Board

Corrective Action

Reliability Testing

Types of Reliability Tests

Burn-in Tests

Environmental Stress Screening Tests

Design Verification Tests

Reliability Development/Growth Tests

Reliability Qualification Tests

Generic Steps for Reliability Tests

Test Plan Development

Chapter 10

Technology Over-view

Introduction

The fabrication of a semiconductor device

Photomasking Process

Metal Deposition Process

Etching Process

Wire Bonding

Different Kinds of Plastic Packages

The Transistor

MOS Technology

Fabrication of a transistor

Technological Challenges

Challenge 1: Achieving High Resolution

Challenge 2: Ensuring Accuracy

Challenge 3: Mass Production

Looking Ahead

Indian Semiconductor Scenario

R&D in Semiconductors in India

Scheme for Promotion of Manufacturing of Electronic Components and Semiconductors (SPECS)

Unit Processes

Lithography

Etching

Oxidation

Deposition

Metalization

Ion implantation

Diffusion

Process Integration

Wafer Preparation

Isolations

Blanket field oxide

Local oxidation of silicon

Shallow trench isolation

Transistor Formation

Chapter 11

Nanotechnology and Nanomanufacturing: From Silicon to New Carbon-based Materials and Beyond

Introduction

What is nanotechnology?

Why Is Nanotechnology Important?

Examples of Nanotechnology

History of Nanotechnology

History of Nanomaterials: From Prehistory to the Modern Age

Faraday Experiments with Nanoparticles

Tools of Nanotechnology in the Twentieth Century

Transmission Electron Microscope (TEM)

Scanning Tunnel Microscope (STM)

Atomic Force Microscope (AFM)

The Age of Nanotechnology from Feynman to Nano-fabrication

Feynman the Father of Nanotechnology

Taniguchi Coins Term Nanotechnology

Drexler and the Coming Era of Nanotechnology

Building on biological principles

Silicon nanoparticles: fabrication, characterization, application and perspectives

Carbon and Carbon Nanomaterials

Introduction

Atomic Structure of Carbon

Nanotechnology Revolutionizing Wafer Manufacturing

Driving Innovation, Collaboration, and Automation

Nanotechnology in Wafer Fabrication

Pioneering Nanopatterning Techniques

Precise Nanoscale Etching and Deposition

Nanoelectronics and Quantum Devices

Innovative Nanomaterials for Advanced Packaging

Nanotechnology for Sensing and MEMS Devices

Challenges and Future Directions

Nanofabrication Opportunities in the Semiconductor Industry

Lithography

Block Copolymer and Polymer Brush Lithography

Polymer Selection

Polymer Deposition onto Substrates

Polymer-Based Pattern Formation

Metal Incorporation and Oxidative Removal of the Polymer

Nanotechnology Metrology

Scope

Current Scientific and Technological Advancements

Goals, Barriers, and Solutions

R&D Investment and Priority Research Areas

Scientific and technical infrastructure needs

Nanotechnology Manufacturing

Manufacturing Approaches to Nanomaterials

How Nanomaterials Are Used in Manufacturing

Nanotechnology-for-semiconductors

Semiconductor nanoparticles

Semiconductors and Artificial Intelligence

Designing the Chips with Artificial Intelligence

AI-Powered Advancements in Chip Design

Revolutionizing Semiconductor Verification and Testing for Enhanced Reliability

Challenges in AI-Driven Chip Design

AI in Semiconductor Industry: Use Cases

AI’s Impact on Future Semiconductor Chip Design Trends

Inside an AI Chip

AI Chips in Brief

No advanced chips, no AI applications

Inside an AI Chip

Microscopic view of an AI chip

AI Chips in Brief

No advanced chips, no AI applications

Primer on AI Chips Fabrication

Front End

Back End

Steps in semiconductor manufacturing

Wet Etching

Dry Etching

Wafer Fabrication

Summary of the major processing steps in the fabrication of a semi-conductor device

Chapter 12

Fundamentals of FinFET and Recent Advances in Nano-scale Silicide Formation

Introduction

FinFET

SOI vs. Bulk FinFET Technology

Use FinFETs

Beyond FinFET and Below 5 nm

Benefits of FinFETSoC Design

Advances in Nanoscale Silicide Formation

Silicide Formation

Solid-State Amorphization

The First Nucleated Phase and Simultaneous Occurrence of Multiphases

Growth Kinetics of Silicides

Dominant Diffusing Species

Epitaxial Growth of Silicides

Nanoscalesilicides

Nanodots

Self-Assembled Low-Resistivity Metal Silicide Quantum Dot Arrays on Epitaxial Si0.7Ge0.3 on (001)Si

Formation of Epitaxial b-FeSi2 Nanodot Arrays on Strained Si/SiO.8Ge0.2 (001) Substrate

First Nucleated Phase and the Dominant Diffusing Species

Nanowires

Self-Assembled Nanowires

Alternative Growth of Silicide Nanowires

Foundations of Microsystems Manufacturing: An Empowering Technology for the IoT

MEMS as a Microsensor:

MEMS as a Microactuator-motor

Components of Microsystems

Typical Microsystems Products

Inertia Sensor for “Air Bag” Deployment System

Evolution of Microfabrication

Application of MEMS and Microsystems in Consumer Products

Functionalisation

Integration

Individualisation

Taking mems technology to the next level

MEMS products and services

TECAWAFER

Wafer manufacturing revolution: functionalisation, integration & customisation

Wafer functionalisation

Wafer integration

Wafer individualisation

Sensors: Revolutionising technology

Sensor functionalisation

Sensor integration

Sensor individualisation

Transformers

Reliable 3D Integrated Circuits

Benefits of 3D Integration in VLSI Circuits

Types of 3D Integration Techniques

Advancements in 3D Integration Technology

Working Principles of 3D ICs

Importance of 3D ICs

Acceleration of Artificial Intelligence (AI)

Addressing Moore’s Law Extension:

Future Challenges of 3D ICs

Design Challenges

Standardization and Interoperability:

Cost Considerations

Wafer State Measurements

Wafer Cutting

Thin Film Deposition

Lithography

Capacitance-Based Technology for Non-Contact Wafer Inspection

Proforma Technology for Non-Contact Wafer Inspection

The Proforma 300i Manual Semiconductor Metrology System

The Proforma 300iSA Semi-Automated Metrology System

Wafer Edge Measurement-pinpoint precise

Wafer Edge Measurement-Reliable Projection Technology

Small footprint and consistent accuracy

Chapter 13

Epitaxy

Types of Epitaxial Growth

Key Parameters to Be Controlled in Epitaxial Growth

Epitaxy Density and Rate

Epi Process Methods

Epitaxial Growth of Thin Film Materials and Its Applications

Chapter 14

Thermal Processing: Anneals, RTP and Oxidation

Thermal Process

Thermal Process Applications

Material Requirements in the Thermal Process–Perfluoroelastomers

How does Thermal Processing/Annealing work?

Chapter 15

Microlithography

The Lithographic Process

Process of semiconductor lithography

Immersion lithography

Multiple patterning

Importance of Microlithography

Photo Solutions’ Custom Microlithography Services

Reticles

Measuring and Calibration Standards

Alignment Targets

Chapter 16

Etching

Basic Processes

Semiconductor Etching Products

Chapter 17

Ion Implantation

Ideal product properties

Ion Implantation Products

Chapter 18

Introduction to Physical Vapor Deposition

Introduction

The Science Behind PVD Coating

The Role of Vacuum in PVD Coating

The Role of Vapor in PVD Coating

Types of PVD Coating Processes Used in Semiconductors

Sputtering

Vacuum chamber for thin film sputtering

Evaporation

Vacuum coating by thermal evaporation

Materials Used in PVD Coating of Semiconductors

Metals

Ceramics

Applications of PVD Coating in Semiconductors

Microelectronics

Chapter 19

Chemical Vapor Deposition

CVD Process in Semiconductors

Chemical Vapor Deposition Techniques

Atmospheric Pressure CVD (APCVD)

Low-pressure CVD (LPCVD)

Plasma Enhanced CVD (PECVD)

CVD in Semiconductor Manufacturing

Chapter 20

Atomic Layer Deposition

Atomic Layer Deposition

The Atomic Layer Deposition (ALD) Process

Comparing ALD and CLD

Key Advantages of ALD

ALD for Microelectronics

Chapter 21

Electrochemical Deposition

Deposition process

Process parameters

Materials in electrochemical cell

Chapter 22

Fundamentals of Chemical Mechanical Planarization

CMP in Shallow Trench Isolation Processing

Chapter 23

AFM Metrology

Atomic Force Microscopy

How an Atomic Force Microscope works

AFM Probe Deflection

Measuring Forces

Feedback Loop for Atomic Force Microscopy

Chapter 24

Wafer Thinning and Singulation

Introduction

Wafer singulation process

Methods for Wafer Thinning

Allegro X for Wafer Packaging

Wafer Thinning Benefits

Wafer Thinning with Conventional Grind

Wafer Thinning with Chemical-Mechanical Planarization (CMP)

Wafer Thinning & Dicing

Chapter 25

Packaging

Wafer-Level Packaging

Bumping and Flip Chips

Redistribution Layers

Fan-Out WLP

Through-Silicon Vias

Packaging Technology Evolution

Understanding Wafer Bumping Packaging Technology

Chapter 26

Interconnect Reliability

Nano-Interconnects

3D Integration

Electromigration

How Does Electromigration Work?

Factors affecting electromigration:

Stress Migration

Chapter 27

Automatic Test Equipment

ATE History

Components of an ATE system

How is ATE used?

Key Automation Tools

Linear Tester

Features

Specification

Mixed-Signal Tester

Mixed-Signal IC Test and Measurement

Purpose of Continuity Testing

Chapter 28

Printed Electronics: Principles, Materials, Processes, and Applications

Printed Electronics vs. Traditional Electronic Device Manufacturing Technology

Printed Electronics Technology

The Concept of Printed Electronics Technology

The Main Elements Involved in Printed Electronics Technology

Main Elements involved in Printed Electronics

Printing

Functional Pattern Carrier

Functional Electronics Inks

Printing Materials

Printing Pressure

Curing/Sintering

The Main Limitations of Printed Electronics Technology

Printed Electronics Products and Developing Trends

Smart Integration Systems

Applications

Consumer electronics

Healthcare

Transportation and logistics

Internet of Things (IoT)

RFID humidity and temperature logger for cigar packet

Chapter 29

Statistical Experimental Design

Statistical Methods

Comparing Distributions

Analysis of Variance

Philosophy of the Taguchi Method

Taguchi Method Design of Experiments

Chapter 30

Process Modelling

Process modelling example

Process specification and verification

Chapter 31

Advanced Process Control

Applications of APC

Terminology:

Run-by-Run Control with Constant Term Adaptation

Chapter 32

Flexible Hybrid Electronics

Opportunities in Flexible Hybrid electronics

Challenges in Flexible Hybrid Electronics

Chapter 33 

Flexible Electronics

Fabrication Process

Key Materials for Fabrication Process

Technologies used in the manufacturing of Flexible Electronics

Applications

Chapter 34

RF Printed Electronics: Communication, Sensing, and Energy Harvesting for the Internet of Things and Smart Skin Applications

Key Points in RF PCBs Manufacturing

Substrate Material Selection

Ensure Accuracy of High-frequency Signal in Production

Types of RF Printed Circuit Boards

Rigid RF PCBs

Flexible RF PCBs

Rigid-Flex RF PCBs

High-Frequency RF PCBs

RF Antenna PCBs

Advantages of RF PCB

Improved Signal Integrity

Low Loss Material

Accurate Impedance Control

High Frequency Operations

Better Component Placement

Reduced Crosstalk

Component Placement and Layout

Signal Integrity and EMI

Manufacturing and Testing Considerations

Smart Skin Applications

Smart skin patches

Frequency

Layout

Shielding

Energy Harvesting for the Internet of Things

How it works:

Benefits

Applications of RF printed electronics energy harvesting in IoT

Chapter 35

Printing of Nanoscale Electronics and Power Electronics

Micro Nano Printing Technologies

Stereolithography Printing

Two Photon Polymerization (TPP)

Dip-Pen Nanolithography (DPN)

Chapter 36

3D Interconnects in Flexiible Electronics

Flexible Electronics

Flexible Interconnects

Chapter 37

Materials for the Manufacturing of an Inkjet Printed Touch Sensor

Workflow of 3D Inkjet Printing (IJP) Fabrication for Printed IDE Capacitive Sensor

Fabrication of FPS Using Inkjet Printer

Verification of Printed FPS

Chapter 38

Flat-Panel and Flexible Display Technology

Applications

Technical details

Electronic paper

HP and ASU e-paper

Asu e-paper

LG e-paper

The Future of Flexible Display Technology

Manufacturing

Types of Display Systems

Chapter 39

Photovoltaics Fundamentals, Manufacturing, Installation and Operations

PV Module Manufacturing

Materials

Chapter 40

Semiconductor Photonic Devices

Various applications for photonic chips

Technology

Features

Application

Chapter 41

Semiconductor Light Detection and Photocell

Digital Camera and CCD

Photoconductor

Photoconductor Construction & Working Principle

Photoconductor Working

Photoconductivity in Semiconductors

Uses of a Photoconductor

Photo-diode

Photoresistor

Transistor Laser

Construction of transistor

Solar Cell

Solar cells: production process

Solar Cell: Technology Analysis

High cost of equipment and materials, high engineering difficulty

N-type IBC solar cells

PERC solar cell efficiency potential analysis

Chapter 42

Dielectric Films Growth

The Growth of Silicon Dioxide Film

Thermal Oxidation Process

Dry oxidation using oxygen gas

Oxide Growth Kinetics

Fabrication Technology of Silicon Dioxide Thin Film

Wet Oxide method

Sample preparation

Procedure

Low temperature oxide (LTO) process

PECVD Process of Silicon Dioxide

Deposition

Film Quality: Moisture, Stress, and Cracking

The Growth of Silicon Nitride Film

Chemical Vapor Deposition

Precursor Gas Atmosphere and Deposition Temperature

Thermal Properties

Physical Vapor Deposition

LPCVD deposition of silicon oxide

LPCVD-depostion of silicon nitrid

LPCVD-depostion of poly-silicon

LPCVD-depostion of metals

PECVD Nitride

PECVD deposition systems

Tension, stress

Chapter 43

Operations, Equipment and Facilities

Yield Management

Strategies for Enhanced Manufacturing Efficiency

Challenges and Solutions in Semiconductor Yield Management: A Comprehensive Overview

The Role of Data Analytics in Semiconductor Yield Management: Leveraging Big Data for Improved Performance

Advanced Process Control Techniques for Semiconductor Yield Improvement

Next-Generation Technologies Driving Innovation in Semiconductor Yield Management

CIM and Factory Automation

MES Fundamentals

The Functions of a Semiconductor Manufacturing Execution System

Manufacturing Process Control

Advanced Process Control

Airborne Molecular Contamination

Monitoring AMCs is Key to Contamination Prevention

Multi-Max AMC Monitoring Solution

Benefits

ESD Controls in Cleanroom Environments

ESD Control in Cleanrooms: A Simple Guide

What is Electrostatic Discharge?

Cleanroom Humidity Control

Cleanroom Personnel Equipment

Cleanroom Furniture Grounding Tabs/Drag Chains

Cleanroom Static Dissipative Flooring

Esd Control Footwear, Casters

Clothing

Vacuum Systems

Cleanliness and Vacuum Technology in Semiconductor Manufacturing

High-Quality Components for Semiconductor Vacuum Systems

Semiconductor Vacuum Systems: Maintain High Purity With Swagelok Fittings

Control of RF Plasma Processing

The Role of Radio Frequency

Gas Ionization Process

Electron Heating Mechanism

Plasma Confinement Techniques

Technical Insights into RF Plasma Generation

Applications of RF Plasma Generators

IC Manufacturing Equipment Parts Cleaning Technology

Uses of Semiconductor Cleaning Equipment

Principle of Semiconductor Cleaning Equipment

Types of Semiconductor Cleaning Equipment

How to Select Semiconductor Cleaning Equipment

Cleaning Process of Semiconductors

Step 1: Initial Cleaning

Step 2: Oxide Removal

Step 3: Particle Removal

Step 4: Chemical Cleaning

Step 5: Final Rinse and Drying

Step 6: Quality Control

Vibration and Noise Design

System Description

Chapter 44

Factors for Constructing Variables Control Charts

Shewhart Control Charts for variables

Process Capability Analysis

General guidelines to prepare control charts

Factors for constructing variables control charts

Chapter 45

Plant Economics of Integrated Circuits

Plant Economics

Plant & Machinery

Fixed Capital

Working Capital Requirement/Month

Total Capital Investment

Turn Over/Annum

Chapter 46

Plant Economics of Earth Leakage Circuit Breakers

Plant Economics

Land & Building

Plant & Machinery

Fixed Capital

Working Capital Requirement/Month

Total Capital Investment

Turn Over/Annum

Chapter 47

Plant Economics of Electric Switches Plugs Sockets & MCB (Miniature Circuit Breaker)

Plant Economics

Land & Building

Plant & Machinery

Fixed Capital

Working Capital Requirement/Month

Total Capital Investment

Turn Over/Annum

Chapter 48

Plant Economics of MCB (Miniature Circuit Breaker) and DB (Distribution Board)

Plant Economics

Land & Building

Plant & Machinery

Fixed Capital

Working Capital Requirement/Month

Total Capital Investment

Turn Over/Annum

Chapter 49

Plant Economics of PCB Laminate and PCB Board

Plant Economics

Land & Building

Plant & Machinery

Fixed Capital

Working Capital Requirement/Month

Total Capital Investment

Turn Over/Annum