PCB (Single Sided and Double Sided Board) (Production Cap: 6000 sq.mt./Day)

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PCB (SINGLE SIDED AND DOUBLE SIDED BOARD) (PRODUCTION CAP: 6000 SQ.MT./DAY)

[EIRI/EDPR/4696] J.C.: 2913XL

PCB Stands for "Printed Circuit Board." A PCB is a thin board made of fiberglass, composite epoxy, or other laminate material. Conductive pathways are etched or "printed" onto board, connecting different components on the PCB, such as transistors, resistors, and integrated circuits.

In other words, A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate.

Multilayer PCB is a type of circuit board that contains three or more layers of conductive material. These boards increase the available area for wiring. Whenever we talk about a number of layers, it means we are considering a number of conducting patterns on the board. Multilayer PCBs are normally Rigid PCB. It is because it is very difficult to create it in a flexible format.

The number of layers depends on your needs. So layers could be up to 100. However, 4 to 8 layer PCBs have common usage in various applications. Circuitry gets complex when layers increase. So you can customize different numbers of layers according to your needs.

COST ESTIMATION

Plant Capacity 6000 sq.mt./Day

Land & Building (20,000 sq.mt.) Rs. 11.99 Cr

Plant & Machinery Rs. 32.00 Cr

Working Capital for 1 Month Rs. 56.08 Cr

Total Capital Investment Rs. 101.05 Cr

Rate of Return 29%

Break Even Point 44%

CONTENTS

INTRODUCTION

TYPES OF PCB

1. SINGLE-SIDED

ADVANTAGES OF SINGLE-SIDED PCBS INCLUDE:

2. DOUBLE-SIDED

COMPARING SINGLE SIDED PCB AND DOUBLE SIDED PCB

PCB

SINGLE-SIDED PCBS

DOUBLE-SIDED PCBS

SINGLE-SIDED PCBS VS. DOUBLE-SIDED PCBS

DIFFERENT TYPES OF PCB

SINGLE-SIDED VS. DOUBLE-SIDED VS. MULTILAYER PCBS

SINGLE-SIDED PCBS

DOUBLE-SIDED PCBS

MULTILAYER PCBS

ADVANTAGE AND APPLICATION OF MULTILAYER PCB

SOME ADVANTAGES OF MULTILAYER PCB OVER OTHER TYPES:

DIFFERENT APPLICATIONS OF MULTILAYER PCB

B.I.S. SPECIFICATION

THE INDIAN STANDARDS RELEVANT TO PCBS ARE:-

PCB MANUFACTURING PROCESS IN DETAILS

THE SECOND STEP OF THE PCB MANUFACTURING

PROCESS: CCL MANUFACTURING

THE THIRD STEP OF THE PCB FABRICATION PROCESS: INNER LINE

THE FOURTH STEP OF THE PCB CONSTRUCTION PROCESS: AOI INSPECTION

FORMAL PCB PRODUCTION LINK: LAMINATION

LAYERING

BONDING

THE SIXTH STEP IN THE PCB FABRICATION PROCESS: DRILLING

THE SEVENTH LINK OF THE PCB MANUFACTURING PROCESS: PANEL PLATING

THE EIGHTH STEP OF THE CIRCUIT BOARD MANUFACTURING PROCESS: SECONDARY INSPECTION

THE FINAL LINK OF THE PCB MANUFACTURING PROCESS: OUTER LAYER PROCESSING

SOLDER MASK LAYER

SILK SCREEN LAYER

SINGLE SIDED PCB MANUFACTURING FLOW CHART

MULTILAYER PCB MANUFACTURING FLOW CHART

DOUBLE SIDED PCB FABRICATION FLOW CHART

COMPONENT OF MULTILAYER PCB

THERE ARE 4 MAIN COMPONENTS OF MULTILAYER PCB AS FOLLOWS:

1. SUBSTRATE:

2. COPPER LAYER:

3. SOLDER MASK:

4. SILKSCREEN:

GUIDE OF MANUFACTURING MULTILAYER PCB

1. DESIGNING

2. PHOTO PLOTTING

3. IMAGING AND DEVELOP OR ETCH

4. AUTOMATED OPTICAL INSPECTION

5. OXIDE

6. LAMINATION

7. DRILLING

8. ELECTROLESS COPPER DEPOSITION

9. DRY FILM OUTER LAYER

10. PLATE

11. STRIPING AND ETCHING

12. SOLDER MASK AND LEGEND

13. SURFACE FINISH

MULTILAYER PCB

SEQUENCES IN MULTILAYER PCB

MATERIAL ISSUE

INNER LAYER

INNER LAYER ETCH

INNER LAYER AOI

LAMINATION

DRILLING

ELECTROLESS AND PANEL PLATING

PTH/ELECTROLESS

PANEL PLATING

OUTER LAYER IMAGE

PATTERN PLATE

OUTER LAYER ETCH

OUTER LAYER AOI

VIA HOLE PLUGGING

SOLDERMASK

SURFACE FINISHES

PROFILE

ELECTRICAL TEST

FINAL INSPECTION

MULTILAYER PCB FABRICATION

THE BARE PRINTED CIRCUIT BOARDS AFTER FABRICATION BEFORE PARTS ARE ASSEMBLED TO IT

BUILDING UP THE INNER LAYERS OF THE CIRCUIT BOARD

LAMINATING THE MULTILAYER BOARD TOGETHER

FINALIZING THE BOARD WITH THE FINISHING TOUCHES

PROCESS FLOW DIAGRAM

TECHNICAL DETAILS IN PCB MANUFACTURE

STEP 1 – THE DESIGN

STEP 2 – PRINTING THE DESIGN

STEP 3 – CREATING THE SUBSTRATE

STEP 4 – PRINTING THE INNER LAYERS

STEP 5 – ULTRAVIOLET LIGHT

STEP 6 – REMOVING UNWANTED COPPER

STEP 7 – INSPECTION

STEP 8 – LAMINATING THE LAYERS

STEP 9 – PRESSING THE LAYERS

STEP 10 – DRILLING

STEP 11 – PLATING

STEP 12 – OUTER LAYER IMAGING

STEP 13 – PLATING

STEP 14 – ETCHING

STEP 15 – SOLDER MASK APPLICATION

STEP 16 – SILKSCREENING

STEP 17 – SURFACE FINISH

STEP 18 – TESTING

TECHNICAL DETAILS OF PCB MANUFACTURE

1. RAW MATERIALS

2. PANELIZATION

SOME GUIDELINES FOR PANELIZATION ARE SIMPLE FOR EXAMPLE WITH ROUTED PANELS:

BUT:

AS WITH ALL TECHNICAL SUBJECTS, EXCEPTIONS ABOUND FOR EXAMPLE:

THIS IS POSSIBLE WITH SOME RESTRICTIONS:

PANELIZATION OF PCBS

3. ETCHING

THE TWO PROCESSING METHODS USED TO PRODUCE A DOUBLE-SIDED PWB WITH PLATED THROUGH HOLES.

CHEMICAL ETCHING

PCBS IN PROCESS OF HAVING COPPER PATTERN PLATED, NOTICE THE BLUE DRY FILM RESIST

4. LAMINATION

5. DRILLING

6. EXPOSED CONDUCTOR PLATING & COATING

SOLDER RESIST

7. SCREENING

8. ASSEMBLY

THE COMPONENTS THAT ARE ASSEMBLED IN THE BOARD INCLUDE:

PCB WITH TEST CONNECTION PADS

AFTER THE BOARD HAS BEEN POPULATED IT MAY BE TESTED IN A VARIETY OF WAYS:

1. SURFACE MOUNT TECHNOLOGY

SURFACES MOUNT COMPONENTS INCLUDING RESISTORS, TRANSISTORS AND AN INTEGERATED CIRCUITS

ASSEMBLY TECHNIQUES

REWORK

2. THROUGH HOLE TECHNOLOGY

CHARACTERISTICS

9. TESTING

10. CUTTING INDIVIDUAL PCBS FROM THE PRODUCTION PANEL

11. FINAL INSPECTION

12. PROTECTION & PACKAGING

ANTISTATIC

MARKET OVERVIEW OF PCB

PRINTED CIRCUIT BOARD (PCB) MARKET TRENDS

CONSUMER ELECTRONICS SEGMENT IS EXPECTED TO HOLD A SIGNIFICANT MARKET SHARE

ASIA-PACIFIC REGION IS EXPECTED TO WITNESS SIGNIFICANT GROWTH

PRINTED CIRCUIT BOARD (PCB) MARKET LEADERS

PRINTED CIRCUIT BOARD (PCB) MARKET NEWS

SUPPLIERS OF PCB BOARD

SUPPLIERS OF PCB

ADDRESSES OF RAW MATERIAL SUPPLIERS

SUPPLIERS OF COPPER FOIL

SUPPLIERS OF FIBRE GLASS EPOXY SHEET

SUPPLIERS OF SILK SCREEN

SUPPLIERS OF ETCHING CHEMICALS AND CLEANINGPCB CHEMICALS

SUPPLIERS OF PRINTING INK

SUPPLIERS OF BARE PCB BOARD

SUPPLIERS OF SOLDER PASTE

SUPPLIERS OF SURFACE MOUNTED DEVICES

ADDRESSES OF PLANT & MACHINE SUPPLIERS

SUPPLIERS OF AUTOMATED PLOTTER

SUPPLIERS OF EXPOSURE SYSTEM

SUPPLIERS OF ETCHING CENTRE

SUPPLIERS OF CNC PCB DRILLING MACHINE

SUPPLIERS OF PCB CUTTING MACHINE

SUPPLIERS OF PCB CLEANING MACHINE

SUPPLIERS OF UV PCB CURRING MACHINE AND SCREEN PRINTING MACHINE

SUPPLIERS OF DRY FILM LAMINATING MACHINE

SUPPLIERSOF COPPER PLATING MACHINE

SUPPLIERS OF PLATING THICKNESS GAUGE

SUPPLIERS OF PCB TESTING EQUIPMENT

SUPPLIERS OF PCB ASSEMBLING PLANT

SUPPLIERS OF AUTOMATIC OPTICAL INSPECTION EQUIPMENT

SUPPLIERS OF AUTOMATIC XRAY INSPECTION MACHINE

SUPPLIERS OF ELECTRICAL MEASURING INSTRUMENTS

SUPPLIERS OF AIR POLLUTION CONTROL EQUIPMENTS

SUPPLIERS OF AIR CONDITIONING EQUIPMENTS

SUPPLIERS OF PLATEFARM WEIGHING MACHINE

SUPPLIERS OF MATERIAL HANDLING EQUIPMENTS

SUPPLIERS OF FIRE FIGHTING EQUIPMENTS

APPENDIX – A:

01. PLANT ECONOMICS

02. LAND & BUILDING

03. PLANT AND MACHINERY

04. OTHER FIXED ASSESTS

05. FIXED CAPITAL

06. RAW MATERIAL

07. SALARY AND WAGES

08. UTILITIES AND OVERHEADS

09. TOTAL WORKING CAPITAL

10. TOTAL CAPITAL INVESTMENT

11. COST OF PRODUCTION

12. TURN OVER/ANNUM

13. BREAK EVEN POINT

14. RESOURCES FOR FINANCE

15. INSTALMENT PAYABLE IN 5 YEARS

16. DEPRECIATION CHART FOR 5 YEARS

17. PROFIT ANALYSIS FOR 5 YEARS

18. PROJECTED BALANCE SHEET FOR (5 YEARS)

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