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    Detailed Project Report on electronic manufacturing service (ems) facility in assembly of pcb and components

    Detailed Project Report on electronic manufacturing service (ems) facility in assembly of pcb and components
    Detailed Project Report on electronic manufacturing service (ems) facility in assembly of pcb and components
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      ELECTRONIC MANUFACTURING SERVICE (EMS) FACILITY IN ASSEMBLY OF PCB AND COMPONENTS
      [CODE NO.3261]  



      A PCB is a printed circuit board is used in electronics to build electronic devices. A PCB serves two purposes in the construction of an electronic device; it is a place to mount the components and it provides the means of electrical connection between the components.

      TYPES OF PCB

      1. Single-sided PCB

      2. Double-sided PCB


      1. Single-sided PCB

      The single-sided PCBs are mostly used in entertainment electronics where manufacturing costs have to be kept at a minimum. However, in industrial electronics also, cost factors cannot be neglected and single-sided boards should be used wherever a particular circuit can be accommodated on such boards.  

      To jump over conductor tracks, components have to be utilized (Fig A). If this is not feasible, jumper wires are used. The number of jumper wires on a board, however, is restricted by economic reasons. If their number is more than a few, the use of a double-sided PCB should be considered.

      Advantages of single-sided PCBs include:

      •    Low cost, especially for volume production;

      •    Low rate of issues during PCB manufacturing process, accordingly, leading to high speed of fabrication;

      •    Suitable for simple circuits.

      2. Double-sided PCB

      Double-sided PCBs can be made with or without plated-through holes. The production of board with plated-through holes is fairly expensive. Therefore, plated-through hole boards are only chosen where the circuit complexity and density does not leave any other choice. Even on such boards, the total number of plated-through holes, in particular of via-holes (holes utilized only for through-contact and not for component mounting), should be kept to the minimum for reasons of economy and reliability.

      The cost factor for double-sided PCBs without plated-through holes is considerably lower because plating can be avoided. Through-contacts are made by soldering the component leads on both the board sides where required. Jumper wires may still be added. However, hand soldering must be applied for soldering of the component side joints.

      In the layout design of such boards, solder joints on the component sides have to be kept minimum in number because the replacing of such components is extremely difficult. A typical strategy is therefore to realize the conductors as much as possible on the non-component side and to put only the remaining once on the component side. Such boards are therefore compromise between serviceability and electrical design optimum on the one hand and the cost factor on the other.


      Therefore, advantages of double-layer PCBs can be summarized into the following aspects:

      •    More flexibility for designers;

      •    An increase of circuit density;

      •    Relatively low cost;

      •    Reduction of board size.



      COST ESTIMATION

      Plant  Capacity                                                     :    10.00 MT./day         
      land & Building (2000 sq.mt)                            :    Rs. 3.32   Cr
      Plant & Machinery                                               :    Rs. 91.00  Lac
      Working Capital for 2 Months                           :    Rs. 2.67   Cr
      Total Capital Investment                                    :    Rs. 7.20   Cr
      Rate of Return                                                      :    37%
      Break Even Point                                                 :    42%


      INTRODUCTION    
      TYPES OF PCB    
      PCB ASSEMBLY    
      FOLLOWING ELECTRONICS PARTS AND CONSUMABLES ARE NEEDED
      FOR PCB ASSEMBLY     
      METHOD OF PCB ASSEMBLY    
      ADVANTAGES:    
      DISADVANTAGES:    
      TYPES OF SMD    
      ACTIVE COMPONENTS    
      TYPICAL APPLICATIONS OF THE SMD COMPONENTS INCLUDE THE FOLLOWING:    
      THE ADVANTAGES OF SURFACE-MOUNT TECHNOLOGY    
      THE DISADVANTAGES OF SURFACE-MOUNT TECHNOLOGY    
      USES AND APPLICATION    
      TYPICAL APPLICATIONS OF THE SMD COMPONENTS INCLUDE THE FOLLOWING:    
      APPLICATION:    
      COMPUTERS    
      B.I.S. SPECIFICATION    
      PROCESS FLOW CHART    
      ASSEMBLING PROCESS OF PCB    
      PROCESS OVERVIEW    
      SMT PROCESS    
      SOLDER PASTE    
      PREHEAT ZONE    
      THERMAL SOAK ZONE    
      REFLOW ZONE    
      COOLING ZONE    
      TYPES OF REFLOW SOLDERING    
      GENERALLY, THERE ARE TWO MAIN TYPES OF LASERS USED FOR REFLOW SOLDERING:    
      CLEANING    
      REWORK    
      INSPECTION OF SOLDERED JOINTS    
      MARKINGS    
      PACKAGING /SHIPMENT    
      MARKET POSITION    
      THE INDIAN PCB INDUSTRY    
      METHODOLOGY    
      MARKET AT A GLANCE    
      GROWTH DRIVERS    
      CHALLENGES FACED BY THE INDUSTRY    
      OTHER CHALLENGES INCLUDE:    
      GROWING INORGANICALLY    
      MOVING FORWARD    
      INDIAN PCB INDUSTRY GROWTH    
      SIGNS OF GROWTH    
      GROWTH DRIVERS    
      THE DEMAND-SUPPLY GAP    
      OBSTACLES IN THE PATH OF GROWTH    
      OTHER CHALLENGES INCLUDE:    
      GROWING INORGANICALLY    
      ADVANTAGES IN INDIA    
      LOOKING AHEAD    
      PLANT LAYOUT    
      MANUFACTURERS/SUPPLIERS OF PCB BOARD    
      SUPPLIERS OF PCB    
      SUPPLIERS OF RAW MATERIALS    
      BARE PCB BOARD    
      SUPPLIERS OF SOLDER PASTE    
      SUPPLIERS OF SURFACE MOUNTED DEVICES    
      SUPPLIERS OF PLANT AND MACHINERY    
      PCB ASSEMBLING PLANT    
      SUPPLIERS OF AUTOMATIC OPTICAL INSPECTION EQUIPMENT    
      SUPPLIERS OF AUTOMATIC XRAY INSPECTION MACHINE    
      ELECTRICAL MEASURING INSTRUMENTS    
      AIR POLLUTION CONTROL EQUIPMENTS    
      AIR CONDITIONING EQUIPMENTS    
      PLATEFARM WEIGHING MACHINE    
      MATERIAL HANDLING EQUIPMENTS    
      FIRE FIGHTING EQUIPMENTS    

                  
      APPENDIX – A:

       1.      COST OF PLANT ECONOMICS      
       2.      LAND & BUILDING                                      
       3.      PLANT AND MACHINERY                                  
       4.      FIXED CAPITAL INVESTMENT                             
       5.      RAW MATERIAL                                         
       6.      SALARY AND WAGES                                     
       7.      UTILITIES AND OVERHEADS                              
       8.      TOTAL WORKING CAPITAL                                
       9.      COST OF PRODUCTION                                   
      10.      PROFITABILITY ANALYSIS                               
      11.      BREAK EVEN POINT                                     
      12.      RESOURCES OF FINANCE                           
      13.      INTEREST CHART                                       
      14.      DEPRECIATION CHART                                   
      15.      CASH FLOW STATEMENT                                   
      16.      PROJECTED BALANCE SHEET      

       

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