Automated PCB Manufacturing Plant (Capacity: 3333 sq mtr per day)

AUTOMATED PCB MANUFACTURING PLANT

[EIRI/EDPR/4690] J.C.: 2907XL

Multilayer PCB is a type of circuit board that contains three or more layers of conductive material. These boards increase the available area for wiring. Whenever we talk about a number of layers, it means we are considering a number of conducting patterns on the board. Multilayer PCBs are normally Rigid PCB. It is because it is very difficult to create it in a flexible format.

The number of layers depends on your needs. So layers could be up to 100. However, 4 to 8 layer PCBs have common usage in various applications. Circuitry gets complex when layers increase. So you can customize different numbers of layers according to your needs.

COST ESTIMATION

Plant Capacity            3333.34 sq.mt./Day

Land & Building (5000 sq.mt.)    Rs. 7.74 Cr

Plant & Machinery                    Rs. 22.84 Cr

Working Capital for 1 Month    Rs. 34.51 Cr

Total Capital Investment          Rs. 65.65 Cr

Rate of Return                          37%

Break Even Point                      38%

CONTENTS

INTRODUCTION

TYPES OF PCB

1. SINGLE-SIDED

ADVANTAGES OF SINGLE-SIDED PCBS INCLUDE:

2. DOUBLE-SIDED

ADVANTAGE AND APPLICATION OF MULTILAYER PCB

SOME ADVANTAGES OF MULTILAYER PCB OVER OTHER TYPES:

DIFFERENT APPLICATIONS OF MULTILAYER PCB

B.I.S. SPECIFICATION

THE INDIAN STANDARDS RELEVANT TO PCBS ARE:-

FOR MORE INFORMATION CONTACT AT:

COMPONENT OF MULTILAYER PCB

THERE ARE 4 MAIN COMPONENTS OF MULTILAYER PCB AS FOLLOWS:

1. SUBSTRATE:

2. COPPER LAYER:

3. SOLDER MASK:

4. SILKSCREEN:

GUIDE OF MANUFACTURING MULTILAYER PCB

1. DESIGNING

2. PHOTO PLOTTING

3. IMAGING AND DEVELOP OR ETCH

4. AUTOMATED OPTICAL INSPECTION

5. OXIDE

6. LAMINATION

7. DRILLING

8. ELECTROLESS COPPER DEPOSITION

9. DRY FILM OUTER LAYER

10. PLATE

11. STRIPING AND ETCHING

12. SOLDER MASK AND LEGEND

13. SURFACE FINISH

MULTILAYER PCB

SEQUENCES IN MULTILAYER PCB

MATERIAL ISSUE

INNER LAYER

INNER LAYER ETCH

INNER LAYER AOI

LAMINATION

DRILLING

ELECTROLESS AND PANEL PLATING

PTH/ELECTROLESS

PANEL PLATING

OUTER LAYER IMAGE

OUTER LAYER IMAGE

PATTERN PLATE

PATTERN PLATE

OUTER LAYER ETCH

OUTER LAYER ETCH

OUTER LAYER AOI

VIA HOLE PLUGGING

SOLDERMASK

SURFACE FINISHES

SURFACE FINISHES

PROFILE

ELECTRICAL TEST

FINAL INSPECTION

MULTILAYER PCB FABRICATION

THE BARE PRINTED CIRCUIT BOARD AFTER FABRICATION

BEFORE PARTS ARE ASSEMBLED TO IT

BUILDING UP THE INNER LAYERS OF THE CIRCUIT BOARD

LAMINATING THE MULTILAYER BOARD TOGETHER

FINALIZING THE BOARD WITH THE FINISHING TOUCHES

PROCESS FLOW DIAGRAM

TECHNICAL DETAILS IN PCB MANUFACTURE

STEP 1 – THE DESIGN

STEP 2 – PRINTING THE DESIGN

STEP 3 – CREATING THE SUBSTRATE

STEP 4 – PRINTING THE INNER LAYERS

STEP 5 – ULTRAVIOLET LIGHT

STEP 6 – REMOVING UNWANTED COPPER

STEP 7 – INSPECTION

STEP 8 – LAMINATING THE LAYERS

STEP 9 – PRESSING THE LAYERS

STEP 10 – DRILLING

STEP 11 – PLATING

STEP 12 – OUTER LAYER IMAGING

STEP 13 – PLATING

STEP 14 – ETCHING

STEP 15 – SOLDER MASK APPLICATION

STEP 16 – SILKSCREENING

STEP 17 – SURFACE FINISH

STEP 18 – TESTING

MANUFACTURING PROCESS OF PCB

1. RAW MATERIALS

2. PANELIZATION

SOME GUIDELINES FOR PANELIZATION ARE SIMPLE FOR EXAMPLE

WITH ROUTED PANELS:

BUT:

AS WITH ALL TECHNICAL SUBJECTS, EXCEPTIONS ABOUND FOR EXAMPLE:

THIS IS POSSIBLE WITH SOME RESTRICTIONS:

PANELIZATION OF PCBS

3. ETCHING

THE TWO PROCESSING METHODS USED TO PRODUCE A DOUBLE-SIDED

PWB WITH PLATED THROUGH HOLES.

CHEMICAL ETCHING

PCBS IN PROCESS OF HAVING COPPER PATTERN PLATED, NOTICE

THE BLUE DRY FILM RESIST

4. LAMINATION

5. DRILLING

6. EXPOSED CONDUCTOR PLATING & COATING

SOLDER RESIST

7. SCREENING

8. ASSEMBLY

THE COMPONENTS THAT ARE ASSEMBLED IN THE BOARD INCLUDE:

PCB WITH TEST CONNECTION PADS

AFTER THE BOARD HAS BEEN POPULATED IT MAY BE TESTED IN

A VARIETY OF WAYS:

1. SURFACE MOUNT TECHNOLOGY

SURFACES MOUNT COMPONENTS INCLUDING RESISTORS,

TRANSISTORS AND AN INTEGERATED CIRCUITS

ASSEMBLY TECHNIQUES

REWORK

2. THROUGH HOLE TECHNOLOGY

CHARACTERISTICS

9. TESTING

10. CUTTING INDIVIDUAL PCBS FROM THE PRODUCTION PANEL

11. FINAL INSPECTION

12. PROTECTION & PACKAGING

ANTISTATIC

RAPID GROWTH OF PCB INDUSTRY IN INDIA

GLOBAL PCB MARKET

INDIAN PCB MARKET

PCB MARKET SEGMENT

PCB LAMINATE TYPES

CHALLENGES FACED BY INDIAN PCB INDUSTRY

MARKET OVERVIEW OF PCB

SOME OF THESE KEY PLAYERS INCLUDE:

SUPPLIERS OF PCB BOARD

SUPPLIERS OF PCB

ADDRESSES OF RAW MATERIAL SUPPLIERS

SUPPLIERS OF COPPER FOIL

SUPPLIERS OF FIBRE GLASS EPOXY SHEET

SUPPLIERS OF SILK SCREEN

SUPPLIERS OF ETCHING CHEMICALS AND CLEANINGPCB CHEMICALS

SUPPLIERS OF PRINTING INK

SUPPLIERS OF BARE PCB BOARD

SUPPLIERS OF SOLDER PASTE

SUPPLIERS OF SURFACE MOUNTED DEVICES

ADDRESSES OF PLANT AND MACHINERY

SUPPLIERS OF AUTOMATED PLOTTER

SUPPLIERS OF EXPOSURE SYSTEM

SUPPLIERS OF ETCHING CENTRE

SUPPLIERS OF CNC PCB DRILLING MACHINE

SUPPLIERS OF PCB CUTTING MACHINE

SUPPLIERS OF PCB CLEANING MACHINE

SUPPLIERS OF UV PCB CURRING MACHINE & SCREEN PRINTING MACHINE

SUPPLIERS OF DRY FILM LAMINATING MACHINE

SUPPLIERSOF COPPER PLATING MACHINE

SUPPLIERS OF PLATING THICKNESS GAUGE

SUPPLIERS OF PCB TESTING EQUIPMENT

SUPPLIERS OF PCB ASSEMBLING PLANT

SUPPLIERS OF AUTOMATIC OPTICAL INSPECTION EQUIPMENT

SUPPLIERS OF AUTOMATIC XRAY INSPECTION MACHINE

SUPPLIERS OF ELECTRICAL MEASURING INSTRUMENTS

SUPPLIERS OF AIR CONDITIONING EQUIPMENTS

SUPPLIERS OF PLATEFARM WEIGHING MACHINE

SUPPLIERS OF MATERIAL HANDLING EQUIPMENTS

SUPPLIERS OF FIRE FIGHTING EQUIPMENTS

APPENDIX – A:

01. PLANT ECONOMICS

02. LAND & BUILDING

03. PLANT AND MACHINERY

04. OTHER FIXED ASSESTS

05. FIXED CAPITAL

06. RAW MATERIAL

07. SALARY AND WAGES

08. UTILITIES AND OVERHEADS

09. TOTAL WORKING CAPITAL

10. TOTAL CAPITAL INVESTMENT

11. COST OF PRODUCTION

12. TURN OVER/ANNUM

13. BREAK EVEN POINT

14. RESOURCES FOR FINANCE

15. INSTALMENT PAYABLE IN 5 YEARS

16. DEPRECIATION CHART FOR 5 YEARS

17. PROFIT ANALYSIS FOR 5 YEARS

18. PROJECTED BALANCE SHEET FOR (5 YEARS)